CALL FOR PAPERS - IEEE COINS 2025

IEEE International Conference on Omni-layer Intelligent Systems (COINS)

University of Wisconsin–Madison, USA | August 4-6, 2025

Conference website: https://coinsconf.com

Important Dates:

Abstract submission: 1 April 2025

Full paper submission: 8 April 2025

Special session, workshop, tutorial proposal submission: 8 April 2025

Acceptance notification: 31 May 2025

Camera-ready submission: 21 June 2025

Are you interested in taking part in shaping and adding new dimensions to the
future IoT and AI ecosystem? Do you want to stay ahead and learn about the most
prominent digital technologies that are radically shifting the paradigm? Or are
you just curious about what IoT, AI, and Big Data are all about and how they
impact every aspect of our lives, society, and business?

IEEE COINS (https://coinsconf.com) is the right place to be. IEEE COINS brings
together experts in Digital Transformation (from AI and IoT to Cloud, low power
design, security, privacy, and robotics) from around the globe.

IEEE COINS includes a multi-disciplinary program, from technical research
papers to panels, workshops, and tutorials on the latest technology
developments and innovations. IEEE COINS will address all important aspects of
the of the IoT/AI ecosystem. IEEE COINS solicits papers and proposals
accompanying submissions for presentations in the following topical and
vertical tracks.

Topical Area Tracks:

1. Internet of Things: From Edge to Cloud

2. Sensing Devices and Systems for AIoT

3. Circuits and Systems (CAS) Designs AIoT

4. Communications and Networking for AIoT

5. Artificial Intelligence, Machine Learning, and Cognitive Computing

6. Distributed Ledger Technologies and Blockchain

7. Low Power Design and Automation

8. Security and Privacy

9. Intelligent Robots and Systems

10. Embedded AI

Vertical Tracks:

1. Smart Infrastructure

      - Smart City

      - Energy and Smart Grids

      - Smart Agriculture

      - Smart Mobility, Transportation, and Logistics

2. Industry 4.0 and Smart Manufacturing

3. Digital Healthcare and Well-being

Special Tracks

1. Emerging Technologies on Intelligent Systems

2. Generative AI: Systems, Architectures, and Applications

Panels

1. Diversity, Equity, and Inclusion

2. Industrial Talks

3. Workshops/Tutorials

Organizing Committee:

General Co-Chairs

Umit Yusuf Ogras, University of Wisconsin-Madison

Amit Singh, University of Essex

Technical Program Co-Chairs

Fatemeh Afghah, Clemson University

Priya Panda, Yale University

Publicity Chair Co-Chair:

Aly Sabri Abdalla, Mississippi State University

Nicola Dall'Ora, University of Verona, Italy

Jaeha Kung, Korea University

Sumit K Mandal, IISC Bangalore

Oktay Cetinkaya, Univ. of New Castle